Moldex3D Comes to the US
With the appointment of EPS FloTek, Naperville, IL as the sole distributor of Moldex3D in the US, considerable interest has developed for this program amongst the automobile manufacturers and Tier-1 suppliers, who are currently beta-testing the latest version of the software.
About Moldex3D
Based on the High Performance Finite Volume Method (HPFVM), and fast, accurate algorithms for volume tracking and filling, Moldex3D sidesteps all the artificial intermediaries in injection molding simulation. The program offers solvers for Flow, Pack, Cool, Warp, and Fiber Orientation.
Moldex3D has been continuously growing for over 15 years and has been benchmarked for over 1,300 different products. The program includes a database of over 5,600 materials and is in use at more than 1,000 companies in the Orient, including US-based companies like IBM, Ford, Molex and HP.
The software includes many modeling features to incorporate critical components of the cooling circuit, runners, mold base inserts, etc. The construction of models for pre-processing is accomplished in the MoldexMesh module, which works as a plug-in with the popular CAD program Rhinoceros™.
For quick analysis of Flow only, Moldex3D partners with Solidworks™. This product -Moldex3D Works - employs voxel, or hexahedral, elements and is an extremely fast way to optimize gate size and location, as well as the flow pattern, well ahead of the mold design.
The part shown here is not amenable to 2D midsurface modeling. The solution provides melt front animation that is both realistic and intuitive. The frozen layer can be viewed in real 3D, as opposed to a simple map of "percent thickness."
Moldex3D has been verified for accuracy with over 1,300 different parts from various industries.
Salient Features
of Moldex3D
|
|
Pre and Post Processor |
Available |
Mesh Import/Export |
Available |
Element Types |
Triangular, Line, Quad, Tetra,
Hexa, Prism, & Higher orders |
Material Library |
5,600+, & User-definables |
Process Setting |
CAE Wizard, or Fully User
defined, profiling flow, pressure, |
Batch, Timed run |
Available |
Visualizer |
Flow front, Fiber Orientation,
Pressure, Temperatures, Slice Planes, iso-surfaces, Avi-files, e-Reports. |
Solvers for |
Flow/Pack/Cool/Warp/Fiber |
Coolant Circuit |
Various shapes, baffles,
bubblers, manifolds, Various coolant fluids |
Mold base |
Several Mold base materials,
mold base inserts, user-defined materials (for overmold) |
Runners |
Hot runners, cold runners,
valve-gates |
Anisotripic Moduli |
Predict locally Anisotropic
moduli, and export to ABAQUS FEA |
Special Nodes |
Available, especially for
tracking gate area |