Moldex-RIM
Source: EPS FloTek
Moldex-RIM accurately models the curing kinetics of thermosetting material (molding compound in IC packaging) and provides mold filling and curing analysis results.
The reactive molding process is challenging due to its complexity. Moldex-RIM accurately models the curing kinetics of thermosetting material (molding compound in IC packaging) and provides mold filling and curing analysis results.
EPS FloTek, 1952 McDowell Road, Unit 106, Naperville, IL 60563. Tel: 630-778-7773; Fax: 630-778-1113.
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